High Vacuum Plasma-enhanced Chemical Vapor Deposition (CCP type) - VTC-PECVD
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Delivery and Shipping to EU
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High Vacuum Plasma-enhanced Chemical Vapor Deposition (CCP type) - VTC-PECVD
MTI
VTC-PECVD is a CCP type ( Capacitively Coupled Plasma) plasma-enhanced chemical vapor deposition (PECVD) system with a high vacuum chamber. It is designed for plasma-assisted thin-film coating at lowered temperature (200 ~ 500°C), compared to the normal deposition at 700~950°C. The high vacuum chamber also provides a clean environment which greatly improves the film size, uniformity, and film quality.
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