GaSb Wafer (100), undoped, 2"x0.5 mm two sides polished - GSUa50D05C2US
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GaSb Wafer (100), undoped, 2"x0.5 mm two sides polished - GSUa50D05C2US
MTI
Wafer Specifications:.
- Size: 2" diameter x 0.5mm,
- Orientation: (100)
- Dopping: undoped,
- Conducting type: P-type.
- Polish: two sides polished by CMP
- Roughness: < 0.5nm
- Packing: 1000 class clean room in a single wafer container
- Crystal Structure: cubic a = 6.095 ??0‡3
- Density: 5.619 g/cm3
- Melting point: 710 oC
- Grown by a special LEC technique , EPD :<10000/cm2
- Thermal Expansion: 6.1 x 10 -6 /oK
- Thermal conductivity: 270 mW / cm.k at 300K
Dopant |
Type |
Carrier Concentration ( cm-3) |
Mobility ( cm2/V.Sec) |
Resistivity ( ohm-cm ) |
EPD (cm-2) |
Undoped |
P |
1.0~2.0 x 1017 |
600 ~ 800 |
~0.1 |
<10000 |
Zn |
P+ |
2.0~5.0 x 1018 |
300 ~ 500 |
~0.004 |
<10000 |
Te |
N |
2.0~6.0 x 1017 |
2500 ~ 3500 |
~0.05 |
<10000 |
High Resistivity |
P or N |
1.0~2.0 x 1016 |
460 |
~ 1.0 |
<10000 |
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