MTI | SKU:
Fm300SOonSIBa100D05C1R001US
Thermal Oxide Wafer: 300 nm SiO2 Layer on Si (100), 100mm dia x 0.5 mm t, P type, 1SP R:0.01-0.05 ohm.cm
€148,75
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Thermal Oxide Wafer: 300 nm SiO2 Layer on Si (100), 100mm dia x 0.5 mm t, P type, 1SP R:0.01-0.05 ohm.cm
MTI
Thermal oxide
Research Grade , about 80 % useful area
- SiO2 layer on 100mm Silicon wafer
- Oxide layer thickness: 300 nm ( 3000A) +/- 10%
- Refractive index - 1.455
Silicon Wafer Specifications:
- Conductive type: P-type/ B-doped
- Resistivity: 0.01-0.05 ohm.cm (If you would like to measure the resistivity accurately,
please order our Portable 4 Probe Resistivity Testing Instrument.) - Size: 100mm dia +/- 0.5 mm x 0.5 mm th
- Orientation: (100) +/- 0.5o
- Polish: one side polished
- Surface roughness, Ra: < 5A (RMS)
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