MTI  |  SKU: TGTBFO76D3175TCuPlateUS5

BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick)

€1.489,25

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BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick)

MTI

  • Composition:    Bismuth Iron Oxide BiFeO3  Target
  • 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick)
  •  Purity:            > 99.99%


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