GaN -Single Crystal Substrate,N-type, (0001), 10x10.5x0.3 mm , 2SP

GaN single crystal substrates is made by a hydride vapor phase epitaxy (HVPE)-based method. During the HVPE process, HCl reacts with molten Ga to form GaCl, which in turn reacts with NH3 to form GaN. The large growth rate enables the growth of self-supporting wafer thicknesses in a convenient time period.

Specifications of Substrate

• Orientation:                       c-axis (0001) +/- 1.0 ^o
• Type:                                N-type(undoped)
  
• Nominal Thickness             300+/- 25 microns
• Dimension:                       10 mm x 10.5 mm +/- 0.5 mm
• Resistivity                         <0.5 ohm.cm
  
• Dislocation Density            < 5x10^5 cm^-2
• TTV:                                <=15 um
• BOW:                               <=20 um
• Front Surface Finish           (Ga Face), RMS <2.0 nm, Epi-Ready polished  
  
•  Back Sutface Finish:          Epi-Ready polished                                
  
• Useable Surface area:        >90%
  
• Package Single Wafer Container or membrane box 
• For XRD data, please click here

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