MTI  |  SKU: SP05000AB

High Conductive Silver Epoxy for Target Bonding -SP-05000-AB-LD

€0,00

Delivery and Shipping to EU

We will add in the quotation, the shipping, insurance, customs clearance costs.

High Conductive Silver Epoxy for Target Bonding -SP-05000-AB-LD

MTI

The silver epoxy is ideal for bonding the nonmetallic plasma sputtering targets and the copper backing plate. The silver epoxy is mixed at a non-critical 1 to 1 ratio by weight or volume, and it will provide a quick conductive bond at or above room temperature. Typical cure times are approximately 4 hours at 75°C.
SPECIFICATION
Model Silver Epoxy
Conductivity
  • Volume Resistivity < 0.001 ohm-cm
  • Excellent electrical conductivity
  • High-strength conductive bonding
Weight 14 g (0.5 oz) total
Color Silver
Shelf Life 9 months
Curing
  • Small amounts can take several hours to cure at room temperature. 
  • Cure times can be accelerated by heating.
  • For the fastest curing times, maximum conductivity and adhesion, heat the bond to between 175° - 250°F (79° - 121°C) for 10 minutes and allow to cool
Operation Instructions

Please click video to learn how to bond a target with backing plate )		                   
Application Notes
  • Causes eye and skin burns. Harmful if absorbed through the skin. Causes Respiratory tract irritation. May cause allergic skin reaction.
  • Do not try to cure below 75°F/24°C.
  • Working temperature range is -131° to 212°F (-55° to 100°C).
  • Typical working pot life is 10 minutes from mixing.
  • Please email us to learn about Iridium Solder Bonding
  • Please click here to find target from A-Z
Back to top