MTI  |  SKU: ECO419

Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package EQ-ECO-419-LD

€79,82

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Wafer Bonding Tape for Vacuum Chuck in Dicing Saw - 10 feet / package EQ-ECO-419-LD

MTI

EQ-ECO-419-LD is a High strength film is for bonding wafer ( up to 6" Dia ) or thin substrate ( < 2.0 mm thickness ) to vacuum chunk of EC400 dicing saw or any dicing saw with  < 6" diameter vacuum chuck.

SPECIFICATIONS:

Width

6.5"

Thickness

0.25mm

Length

Price sold by 10 feet per quantity

Item

It is the consumable part, replace the gasket each time assembly. It may cause a leak when reusing.

Application Notes

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